ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,538, issued on June 3, was assigned to TDK Corp. (Tokyo). "Multilayer inductor and mounting structure of multilayer inductor" was invented b... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,321,518, issued on June 3, was assigned to SHENZHEN CHUANGWEI-RGB ELECTRONICS Co. LTD. (Shenzhen, China). "Method for changing displayed scene, ... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,323,927, issued on June 3, was assigned to Sharp K.K. (Sakai, Japan). "Power management for integrated access and backhaul networks" was invente... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. D1,077,557, issued on June 3. "Coffee cup" was invented by Jianjun Li (Tai'an, China). The patent was filed on Jan. 23, 2025, under Application No... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,257, issued on June 3, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging device and electronic device" was inve... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,890, issued on June 3, was assigned to Natural Extraction Systems LLC (Boulder, Colo.). "Rapid botanical oil distillation device utilizing m... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,099, issued on June 3, was assigned to NEC Corp. (Tokyo). "Image processing apparatus, image processing method, and non-transitory computer-... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,279, issued on June 3, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Pedestrian collision prevention system and method for v... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,527, issued on June 3, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Electrically insulated cable" was invented by Shig... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,731, issued on June 3, was assigned to AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. (Singapore). "Semiconductor package using a coreless sig... Read More